Electronics heating
The majority of the electronics produced today are designed with high attention to their physical size, especially for those which are IOT based and meant for high end systems found in many tech sectors such as the EV or consumer electronics. These industries place firm requirements on how small the components should be engineered in order to occupy the little as possible space inside the product. Simultaneously, this hardware, whether a chip, a sensor, PCB or other electrical power package, are functioning as super machines and capable of processing high computing power, backed by a smart software that operates the whole assembly. That generates massive heat development which cannot be dissipated outside due to the reduced surface of the components themselves. Looking at the physical meaning of this fact, the possibility of failure rate can be doubled for each 10°C rise in the temperature. The only solution to cope with this situation is to efficiently dissipate the heat generated in the component in order to maintain stable performance and avoid production cease due to the overheating of the components.A customized solution for Electronics heating that cuts you heavy costs
As a resolution, thermally conductive epoxy resins have been developed to connect between the various components surfaces while providing immediate heat transfer to the heat that was generated. These resins can be adapted to different applications by changing their viscosity in order to fit varying flowability requirements. Additional features can be incorporated into the resin for improved shrinkage or UL compliance. These resins are successfully fulfilling this function by formulating the thermoset matrix with conductive fillers in form of particles, whether are made from metals or ceramics.