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Dispensing Equipment
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- Epoxy Resins
- EP 169
- Clear low viscosity epoxy resin
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- Epoxy Resins
- EP 168
- Epoxy Compound for Potting and sealing
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- Epoxy Resins
- EPC 145
- High Filled Epoxy Compound for Potting and Encapsulation
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- Epoxy Resins
- EP 145
- High Filled Epoxy Compound for Potting and Encapsulation
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- Epoxy Resins
- EP 140FR
- Highly filled potting and encapsulating epoxy compound
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- Epoxy Resins
- EP 1140 DV
- High Thermal Conductive Epoxy Adhesive
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- Epoxy Resins
- EPC 1110 DV
- Two-part Fast Cure Semi-flexible Epoxy Adhesive
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- Epoxy Resins
- EP 1110 DV
- Two-part Fast Cure Semi-flexible Epoxy Adhesive
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- Silicone
- 93-500 Thixotropic Kit
- General purpose silicone adhesive/sealant (specified)
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- Silicone
- 732 Multi-Purpose White
- General purpose silicone adhesive/sealant (specified)
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- Silicone
- HEAT SINK 340
- White, non-curing and non-flowing thermally conductive compound
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- Silicone
- SYLGARD 170
- Two-part, 1:1 mix, black, general purpose encapsulant with good flowability, long working time and flame resistance
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- Silicone
- SYLGARD 184
- Transparent encapsulant with good flame resistance
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- Silicone
- 3145 CLEAR
- Clear, non-flowing adhesive with high tensile strength and elongation, MIL-A-46146 Group II tested
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- Epoxy Resins
- EPC 304 IP 5:5
- Highly filled potting and encapsulating epoxy compound
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- Epoxy Resins
- EPC 520
- Highly filled potting and encapsulating epoxy compound
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- Epoxy Resins
- EPC 124
- Highly filled potting and encapsulating epoxy compound
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- Contact Adhesive
- 30NF
- Sprayable contact adhesives for high immediate bond strength and long bonding range.
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