EP 115
Low Viscosity High mechanical performance Room Temperature Curing Epoxy


EP 115 is a low viscosity, room temperature curing epoxy compound for potting, casting and encapsulating, exhibiting good mechanical and insulating properties. EP 115 can be applied with various curing agents depending on customer requests

SKUMaterialBaseHardenerMix ViscosityMix Ratio By WeightShore 7 DaysService TempColorGel Time Min/25CPurposeVolumeUL 94
EP115_2EpoxyEP 115EPC 5012,000-3,000100:40D80-85-30 TO 90Clear50-60Potting1L, 5L
EP115_3EpoxyEP 115EPC 3042,000-3,000100:45D80-85-30 TO 90Clear360-500(AT 40'C )Potting1L, 5L
EP115_1EpoxyEP 115EPC 1401,600-2,4002:1D80-85-30 TO 90Clear250-300Potting1L, 5L
SKU: EP115 Category: Components: Manufacturer:

Features & Benefits:

  • Low viscosity
  • Excellent mechanical properties
  • Flexible pot life
  • High penetration
  • Suitable for manual and
    automatic mixing

Electrical and electronic potting and encapsulation.

EP 115-EPC 140, EPC 304, EPC 501 Download full specs