EP 115
Low Viscosity High mechanical performance Room Temperature Curing Epoxy
EP 115 is a low viscosity, room temperature curing epoxy compound for potting, casting and encapsulating, exhibiting good mechanical and insulating properties. EP 115 can be applied with various curing agents depending on customer requests
| SKU | Material | Base | Hardener | Mix Viscosity | Mix Ratio By Weight | Shore 7 Days | Service Temp | Color | Gel Time Min/25C | Purpose | Volume | UL 94 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| EP115_2 | Epoxy | EP 115 | EPC 501 | 2,000-3,000 | 100:40 | D80-85 | -30 TO 90 | Clear | 50-60 | Potting | 1L, 5L | |
| EP115_3 | Epoxy | EP 115 | EPC 304 | 2,000-3,000 | 100:45 | D80-85 | -30 TO 90 | Clear | 360-500(AT 40'C ) | Potting | 1L, 5L | |
| EP115_1 | Epoxy | EP 115 | EPC 140 | 1,600-2,400 | 2:1 | D80-85 | -30 TO 90 | Clear | 250-300 | Potting | 1L, 5L |
EP 115 Low Viscosity Curing Epoxy Features & Benefits:
- Low viscosity
- Excellent mechanical properties
- Flexible pot life
- High penetration
- Suitable for manual and
automatic mixing
EP 115 Low Viscosity Curing Epoxy Applications:
Electrical and electronic potting and encapsulation.
Download EP 115 Low Viscosity Curing Epoxy full specs
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