Electrical and electronic potting and encapsulation
Electrical and electronic potting and encapsulation
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- Polyurethane
- U 248-2
- Two-Component Rigid Polyurethane Compound
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- Polyurethane
- U 408
- Two-Component Low Viscosity Flexible PU Compound
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- Polyurethane
- U 992
- High dielectric strength polyurethane Compound
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- Polyurethane
- U 405 D
- Two-Component Low Viscosity Flexible PU Compound
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- Polyurethane
- U 405 DS
- Two-Component Low Viscosity Flexible PU Compound
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- Polyurethane
- U 405
- Two-Component Low Viscosity Flexible PU Compound
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- Polyurethane
- U 205
- Two-Component Self-extinguishing Soft PBD-based PU Compound
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- Polyurethane
- U 233
- Two-Component Low Viscosity Potting and Casting Semi-flexible Polyurethane Compound
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- Polyurethane
- U 2047
- Clear Low Viscosity Polyurethane Compound
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- Polyurethane
- U 260
- Two-Component Semi-flexible Polyurethane Compound
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- Polyurethane
- U 106
- General Purpose Urethane Compound for Potting and Sealing
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- Silicone
- RTV 295 LV
- High Thermal Conductive Low Viscous RTV Silicone
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- Polyurethane
- U 105
- Soft, Two Component PBD-based PU Compound offering exceptional hydrolytic stability and very low glass transition
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- Epoxy Resins
- EP 118 FC
- Two-component Low Viscosity Potting and Casting Epoxy Compound
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- Epoxy Resins
- EP 118
- Low Viscosity Potting and Casting Epoxy Compound
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- Epoxy Resins
- EP 501_EPC 501
- Low Viscosity Epoxy Compound for general use
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- Epoxy Resins
- EP 115
- Low Viscosity High mechanical performance Room Temperature Curing Epoxy
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- Epoxy Resins
- EP 71
- Low Viscosity Semi-flexible Room Temperature Curing Epoxy
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- Epoxy Resins
- EP 502 (502BK) EPC 800
- Low Viscosity Epoxy Compound for general use
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- Epoxy Resins
- EP 502 MD
- Two Component Semi-Flexible Epoxy Compound
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- Epoxy Resins
- EP 502 CL
- Low viscosity, unfilled, RT curing epoxy
