HEAT SINK 340
White, non-curing and non-flowing thermally conductive compound
Composition: Zinc oxide, Polydimethylsiloxane
Features & Benefits
- Moderate thermal conductivity
- No need for ovens or curing
- Heat flow away from circuitry components can increase reliability
DOWSIL™ 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.