HEAT SINK 340
White, non-curing and non-flowing thermally conductive compound
HEAT SINK 340 White, non-curing and non-flowing thermally conductive compound Applications
DOWSIL™ 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.
Composition: Zinc oxide, Polydimethylsiloxane
HEAT SINK 340 White, non-curing and non-flowing thermally conductive compound Features & Benefits
- Non-flowing
- Moderate thermal conductivity
- No need for ovens or curing
- Heat flow away from circuitry components can increase reliability
HEAT SINK 340 White, non-curing and non-flowing thermally conductive compound Applications
DOWSIL™ 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.
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