HEAT SINK 340
White, non-curing and non-flowing thermally conductive compound

DOW

Composition: Zinc oxide, Polydimethylsiloxane

Features & Benefits

  • Non-flowing
  • Moderate thermal conductivity
  • No need for ovens or curing
  • Heat flow away from circuitry components can increase reliability

Applications
DOWSIL™ 340 Heat Sink Compound is suitable for thermal coupling of electrical devices and PCB assemblies to heat sinks.

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SKU: 2265931 Category: Components: Manufacturer:

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