Multipurpose heat curing (Cure Schedule, min- 100°C-20-25,120°C-5-7 ) epoxy adhesive
Multipurpose heat curing (Cure Schedule, min- 100°C-20-25,120°C-5-7 ) epoxy adhesive
Home>Product Applications>Multipurpose heat curing (Cure Schedule, min- 100°C-20-25,120°C-5-7 ) epoxy adhesive
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- Epoxy Resins
- EP 951 HV
- One-Component Heat Curing Epoxy Adhesive