EPC 145
High Filled Epoxy Compound for Potting and Encapsulation

Polymer-G

EP 145/EPC 145 is a high filled, moderate viscosity, low temperature curing epoxy compound for potting and encapsulation, exhibiting high mechanical and electrical insulating properties, suitable for prolong pot life application.

EPC 145 Features & Benefits:

  • Low shrinkage
  • High filled
  • Room temperature cured
  • Long pot life
  • Moderate viscosity
  • High penetration

Applications:
Encapsulation and potting of electrical and electronic components.

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SKU: 22002 Category: Components: Manufacturer:

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