EP 145
High Filled Epoxy Compound for Potting and Encapsulation

EP 145/EPC 145 is a high filled, moderate viscosity, low temperature curing epoxy compound for potting and encapsulation, exhibiting high mechanical and electrical insulating properties, suitable for prolong pot life application.

EP 145 High Filled Epoxy Compound for Potting and Encapsulation Features & Benefits:

• Low shrinkage
• High filled
• Room temperature cured
• Long pot life
• Moderate viscosity
• High penetration

EP 145 High Filled Epoxy Compound for Potting and Encapsulation Applications:
Encapsulation and potting of electrical and electronic components.