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Potting and encapsulation of electrical and electronic components

Potting and encapsulation of electrical and electronic components

Home>Product Applications>Potting and encapsulation of electrical and electronic components

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Epoxy Resins(27)
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Silicone(15)
Fast Tack(1)
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UV-LED Curable(7)
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Dispensing Equipment(18)

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Bonding(22)
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Adhesives(3)
Curing Accelerator Additive(1)
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Two Component Mixing and Dispensing(52)

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ELECTRONICS(54)
IOT & SECURITY(44)
AVIATION & AEROSPACE(32)
WATER & FILTRATION(36)
TRANSFORMER(15)
3D PRINTING(4)

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Polymer-G(50)
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DOW(7)
Graco(2)
Viscotec(11)

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1K & 2K Micro Quantities Dispensing(6)
2-Part Benchtop Meter & Mix Dispensing(3)
Automated Dispensing Systems(2)
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Smart 2K Adhesive Dispensing System(1)
Spraying Applications(1)
Supply & Transfer Pumps(2)

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Tel.: +972 (0)8 9987931
Fax: +972 (0)8 9965286
Email: info@polymer-g.com

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magazine

EPV 9411, is a new innovative epoxy resin for fast & cost-effective filament winding production

2K Epoxy Resin to protect transmitting components in a harsh environment including fuels & oils

DESIGNING ELECTRONICS – WHAT TO DO WITH EXCESSIVE ELECTRONICS HEATING?

The Heat Is On – How to Design Electronic Devices That Won’t Overheat

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